SM 2004 utilizes a novel hybrid chemistry producing a polymer with physical properties similar to both silicone and polyurethane. The system offers exceptional adhesion to metal and bonds to most substrates without need for primer. Heat resistant, the cured system can withstand temperatures up to 150°C (302°F) and excursion as high as 176°C (~350°F) without losing elastomeric properties. Additionally, SM 2004 is thermally conductive and helps dissipate heat away from embedded electronic components. Well-suited for potting applications, the A and B components mix to form a low to medium viscosity fully flowable liquid with a generous 30-minute pot-life. The system can be handled after 2 hours of room temperature cure. SM 2004 is an ideal candidate for general purpose elastomeric potting/encapsulant or sealant applications or other applications where silicone and polyurethanes are used. The compound offers greater heat resistance than most urethanes. And it offers better adhesion and physical properties than silicone without the cure-inhibition and migration issues common to silicone systems. SM 2004 is particularly well-suited for applications where sensitive electronic components are subject to thermal cycling and need a stress accommodating polymer to absorb vibration or impact.