GSP 1362 is a two-part epoxy potting compound designed for insulative encapsulation of electronic components in high-temperature applications. The cured system can withstand thermal cycling up to 400°F and is thermally conductive enabling the quick dissipation of heat away from embedded electronic components. Because of its flexible character, the system is resistant to both impact and thermal shock. GSP 1362 has a long working time and processes easily with a low mixed viscosity. The mixed system provides very good wet-out of electronic components during application and has excellent adhesion to most substrates. The system cures with low exotherm. GSP 1362 is ideal for electronic potting applications with exposure to high temperatures. The system is available in multiple packaging options including hand-mix kits and Side-by-side 1A:2B cartridge systems.