GSP 1345 Thermally Conductive Epoxy Potting Compound

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GSP 1345 Thermally Conductive Epoxy Potting Compound

SKU: GSP 1345

Description:

GSP 1345 is a two-part, thermally conductive epoxy system. It features an easy to use 1:1 mix ratio. With virtually no settling of fillers, it is can be packaged and stored in cartridges. The system is a good candidate in potting applications where heat transfer is required. This system exhibits robust cured properties with excellent adhesion and impact resistance.

Tech Data Sheet:

GSP-1345-TDS.pdf

Safety Data Sheet:

GSP-1345AB-SDS.pdf

Chemistry

Epoxy

Ratio by Weight:

100A:100B

Ratio by Volume:

1:1

Cure Conditions:

24 hours @ RT; 2 hours @ 120ºF

Hardness:

85 D

Thickness:

Semi-Flowable

Color:

White

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