Call Us: 951-360-0607

GSP 1345 Thermally Conductive Epoxy Potting Compound

GSP 1345 Thermally Conductive Epoxy Potting Compound

2-Part Epoxy Potting Compounds
SKU: GSP 1345
Description:

GSP 1345 is a two-part, thermally conductive epoxy system. It features an easy to use 1:1 mix ratio. With virtually no settling of fillers, it is can be packaged and stored in cartridges. The system is a good candidate in potting applications where heat transfer is required. This system exhibits robust cured properties with excellent adhesion and impact resistance.

Tech Data Sheet:
Safety Data Sheet:
Chemistry
Epoxy
Ratio by Weight:
100A:100B
Ratio by Volume:
1:1
Cure Conditions:
24 hours @ RT; 2 hours @ 120ºF
Hardness:
85 D
Thickness:
Semi-Flowable
Color:
White
Back to Top