GSP 1339-1 is a low-viscosity, two-part, room temperature cure, epoxy adhesive system designed to accommodate higher temperature applications, while offering excellent chemical resistance and good general adhesion to a wide range of substrates. For purposes of viscosity thinning, small quantities of acetone may be added to the mixed product (acetone is a HAPS exempt solvent). Packaging options vary, including convenient 4:1 ratio dual syringes.