GSP 1345 Thermally Conductive Epoxy Potting Compound
Category: 2-Part Epoxy Potting Compounds
SKU: GSP 1345
Description:
GSP 1345 is a two-part, thermally conductive epoxy system. It features an easy to use 1:1 mix ratio. With virtually no settling of fillers, it is can be packaged and stored in cartridges. The system is a good candidate in potting applications where heat transfer is required. This system exhibits robust cured properties with excellent adhesion and impact resistance.
Tech Data Sheet: https://www.gspolymers.com/wp-content/uploads/GSP-1345-TDS.pdf Safety Data Sheet: https://www.gspolymers.com/wp-content/uploads/GSP-1345AB-SDS.pdf Chemistry: EpoxyRatio by Weight: 100A:100B
Ratio by Volume: 1:1
Cure Conditions: 24 hours @ RT; 2 hours @ 120ºF
Hardness: 85 D
Thickness: Semi-Flowable
Color: White