GSP 1345 Thermally Conductive 1:1 Potting Compound
SKU:
GSP 1345
Two Part, 1:1,thermally conductive potting compound, excellent adhesion and impact resistance, available in cartridges
GSP 1345 offers the benefits of heat dissipation required for your part, and the operator-preferred application method. No more premixing of the components, no more awkward ratios. Just more GSP innovation working for you.
Tech Data Sheet:
Material Safety Data Sheet:
Chemistry:
Epoxy
Gel Time:
60 minutes
Cure Conditions:
2 hours at 120°F (50°C,) or 24 hours at room temperature
Hardness:
80 - 85 D