GSP 1345
SKU:
GSP 1345
GSP 1345 is a two-part, thermally conductive epoxy system. It features an easy to use 1:1 mix ratio. With virtually no settling of fillers, it is can be packaged and stored in cartridges. The system is a good candidate in potting applications where heat transfer is required. This system exhibits robust cured properties with excellent adhesion and impact resistance.
Tech Data Sheet:
Material Safety Data Sheet:
Chemistry:
Epoxy
Ratio by Weight:
100A:100B
Ratio by Volume:
1:1
Gel Time:
1 hour
Cure Conditions:
24 hours @ RT;
2 hours @ 120ºF
Hardness:
85 D
Thickness:
Semi-Flowable
Color:
White